| 摘要 |
<p>PURPOSE: To prevent the leakage of a high-frequency signal and to reduce in size and cost a high-frequency circuit device by forming an insulator on first and/or second GND pattern formed on the uppermost and lowermost layers of a multilayer board, and forming a land in the insulator. CONSTITUTION: A rectangular insulator 11a is formed on a first GND pattern 11. A land 11b for connecting a high-frequency electronic component 20 is provided in the insulator 11a. The land 11b is connected to a high-frequency circuit pattern 13 of an inner layer via a viahole 10a, thereby forming a high-frequency circuit. The component 20 mounted on the pattern 11 is covered with a metal cap 30. The external leakage of the high-frequency signal generated from the pattern 13 can be prevented by the patterns 11, 12.</p> |
