发明名称 |
APPARATUS AND METHOD FOR MOUNTING AN ELECTRONIC COMPONENT TO A SUBSTRATE |
摘要 |
The electronic component (10) has a die (22) and a terminal (14) coupled to the die (22). The substrate has a first side (20) and a second side (82) and a passage (26) therethrough. The terminal (14) is in communication with the first side (20) and the die (22) is disposed within the passage (26). The apparatus includes a cover (16) which encloses the die (22) and a portion of the terminal (14), and has a fixed portion (28) and a removable portion. The fixed portion (28) includes a connection region coupled to the terminal (14) and an extension region disposed within the passage (26). The extension region has a surface that is substantially coplanar with the second side (82). There is a space (32) between the extension region and the substrate (18). An adhesive (34) is disposed on the surface of the extension region, extending into the space (32). A sealing frame (36) overlaps the space (32) and is in communication with the adhesive (34) and the second side (82). |
申请公布号 |
EP0903060(A1) |
申请公布日期 |
1999.03.24 |
申请号 |
EP19970906616 |
申请日期 |
1997.02.13 |
申请人 |
MOTOROLA, INC. |
发明人 |
LIMPER-BRENNER, LINDA;SCHMIDT, DETLEF, W.;MCDUNN, KEVIN, J.;PRESS, MINOO, D. |
分类号 |
H05K1/18;H01L23/473;H05K5/06;(IPC1-7):H05K1/18;H01L23/02 |
主分类号 |
H05K1/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|