| 摘要 |
<p>Method for manufacturing a pressure-measuring device comprising a diaphragm of semiconductor material having a resonating element fixed thereto, said diaphragm being exposed to the pressure of a process fluid, and comprising the following phases: i) machining a multilayer semiconductor material to obtain a diaphragm having on the upper side a resonating element, an excitation element and a detection element for measuring the pressure applied to said diaphragm; ii) machining a semiconductor material having one or more layers to obtain a support having a pressure port for the flow of the process fluid; iii) making a bond between the lower side of said diaphragm and the upper side of said support. <IMAGE></p> |
