发明名称 RESIN MOLDING METHOD AND RESIN MOLDING DEVICE
摘要 PROBLEM TO BE SOLVED: To make it possible to mold a resin with high reliability without generating an unnecessary resin flash on the surface of a piece to be molded. SOLUTION: This resin molding method is to coat a parting face including a resin molding part of at least, either of a top force 20a or a bottom force 20b of a mold with a release film 50 and feed a resin material 34 melted in a pot 26 to a cavity 28 from the pot 26 under pressure, when clamping a piece to be molded 10 between the top force 20a and the bottom force 20b. In this method, the resin material 34 is molded by pressing the surface part exposed to the outside of the piece to be molded 10 into contact with the parting face with the release film 50 after molding, when the piece to be molded 10 is clamped through the release film 50.
申请公布号 JPH1177734(A) 申请公布日期 1999.03.23
申请号 JP19980120793 申请日期 1998.04.30
申请人 APIC YAMADA KK 发明人 MIYAJIMA FUMIO
分类号 B29C33/68;B29C45/00;B29C45/02;B29C45/14;B29L31/34;H01L21/56;(IPC1-7):B29C45/02 主分类号 B29C33/68
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