| 摘要 |
A photoresist composition containing a photo-curing polymer and a photosensitive agent, wherein the photosensitive agent comprises at least two compounds selected from the group consisting of 4,4'-diazido-2,2'-stilbenedisulfonate sodium salt, 4,4'-diazo-2,2'-dibenzalacetone disulfonate disodium salt, 2,5-bis(4-azido-2-sulfobenzylidene) cyclopentanone disodium salt and 4,4'-diazido-2,2'-dicinnamylideneacetone sulfonate salt. By performing a lithography process using the photoresist composition, the exposure time can be shortened, thereby improving the yield of products.
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