发明名称 |
Polishing fluid composition and polishing method |
摘要 |
The present invention provides a polishing fluid composition which can effectively polish a surface of a semiconductor silicon wafer or a surface of a film comprising silicon to be formed on silicon wafers with a markedly reduced amount of colloidal silica to be used as abrasives, or a polishing fluid composition which is particularly useful for a polishing step after removal of an oxide layer in a two-step polishing method. The former polishing fluid composition comprises an alkaline suspension which contains a water-soluble silicic acid component, colloidal silica and an alkaline component, and which has a pH value of 8.5 to 13. Meanwhile, the latter polishing fluid composition comprises an alkaline solution which contains a water-soluble silicic acid component and an alkaline component, and which has a pH value of 8.5 to 13; and is substantially free of abrasive particles.
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申请公布号 |
US5885334(A) |
申请公布日期 |
1999.03.23 |
申请号 |
US19970857366 |
申请日期 |
1997.05.15 |
申请人 |
KABUSHIKI KAISHA KOBE SEIKO SHO |
发明人 |
SUZUKI, TETSUO;HARA, YOSHIHIRO |
分类号 |
C09G1/02;C09K3/14;(IPC1-7):C09K13/04 |
主分类号 |
C09G1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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