| 摘要 |
<p>PROBLEM TO BE SOLVED: To paste laminate films to a board and separate them from each other without cutting off the photosensitive resin layer of the laminate film or executing half-cutting. SOLUTION: In a film pasting device 10, at the pasting of the photosensitive resin layer 14B exposed from a laminate film 14 to a board 20, under the condition that interposing sheets 30A and 30B are temporarily attached on the no- wanted pasting regions 20A and 20B of the photosensitive resin layer at the front and rear ends of the board 20, the linear projections 31A and 31B of the interposing sheets 30A and 30B bite in the photosensitive resin layer 14B on the boundary lines 36A and 36B between the no-wanted pasting regions 20A and 20B and the pasting region 20C so as to cut off the layer 14B when the interposing sheets pass between lamination rolls 22A and 22B. By lifting the interposing sheets 30A and 30B together with a light transmitting supporting film at the outlet side of the laminating rolls 22A and 22B, the unnecessary portion of the photosensitive resin layer 14B and the interposing sheets 30A and 30B are separated from the board 20.</p> |
