TAKE-OUT MECHANISM FOR SEMICONDUCTOR WAFER IN CARRIER CASE

摘要

PROBLEM TO BE SOLVED: To provide a take-out mechanism for a semiconductor wafer in a carrier case whereby proper work for taking out the semiconductor wafer can be performed, the semiconductor wafer and a cushioning sheet can be accurately separated. SOLUTION: A device comprises a mounting base 2 loading in a liftable manner a carrier case 70 of semiconductor wafers W stored to be layered by interposing cushioning sheets P there between, transfer loading arm 4 taking out the semiconductor wafer or the cushioning sheet in the carrier case provided adjacent to this mounting base, and a blowing mechanism 6(8) arranged in the vicinity of the semiconductor wafers or the cushioning sheets so as to blow gas from the blowing mechanism when the transfer loading arm sucks the semiconductor wafer or the cushioning sheet in the carrier case.