发明名称 AUTOMATIC POLISHING METHOD FOR LEAD TERMINAL OF SURFACE MOUNTING PACKAGE AND EQUIPMENT THEREFOR
摘要 PROBLEM TO BE SOLVED: To promptly, positively polish lead terminal parts. SOLUTION: Pressing a start switch 36 starts polishing. On completing the polishing for each one side of lead terminals of a plurality of packages, a polishing stage 11 lifts a lead clamp to drive a motor 16, resulting in rotating a polishing table 14 by 90 degrees. The polishing stage 11 then returns the lead clamp to the original position for restarting the polishing. The number of polished sides is displayed on a display lamp 35. Completing the polishing for all the sides of the lead terminals automatically completes the polishing.
申请公布号 JPH1177512(A) 申请公布日期 1999.03.23
申请号 JP19970243709 申请日期 1997.09.09
申请人 OKI ELECTRIC IND CO LTD 发明人 SATO TAKEYUKI
分类号 B24B29/00;B24B29/02;H01L21/48;H01L23/50;(IPC1-7):B24B29/00 主分类号 B24B29/00
代理机构 代理人
主权项
地址