| 摘要 |
The present invention relates to a semiconductor device for improving a noise characteristic by supplying a stable power within a chip. The semiconductor device has: a lead frame body for bonding a chip in a package, and transmitting power supply voltage; a plurality of main pads provided within the chip and connected to external pins through wires; dummy pads connected to the lead frame body through wires, capable of supplying power, and provided in edges of the chip; and power pad pins connected in common to the lead frame body and the main pads through wires, and provided with ground potential and power supply voltage. <IMAGE> |
