COLUMN LEAD TYPE PACKAGE AND METHOD OF MAKING THE SAME

摘要

A semiconductor device package contains column leads which are electrically connected to a chip. The column leads, chip and electrical connection means are encapsulated to form a package body, from which the column leads extend for connection to a substrate such as a printed circuit board. A lead frame for the column leads can be formed by etching the column leads and a die pad out of a section of column lead material with a polyimide layer backing. Alternatively, a lead frame having parallel side rails on either side of a die pad can be used as an assembly frame for rows of column leads. Mass production of this package body using either type of lead frame produces high reliability packages in a simple and cost-effective way.