LEADFRAME AND SEMICONDUCTOR CHIP PACKAGE,申请号KR19960028598-传众专利搜索

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发明名称	LEADFRAME AND SEMICONDUCTOR CHIP PACKAGE
摘要
申请公布号	KR0185571(B1)	申请公布日期	1999.03.20
申请号	KR19960028598	申请日期	1996.07.15
申请人	SAMSUNG ELECTRONICS CO., LTD.	发明人	KIM, TAE-HYUNG;CHO, INN-SIK
分类号	H01L23/28;(IPC1-7):H01L23/28	主分类号	H01L23/28
代理机构		代理人
主权项
地址

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