| 摘要 |
Disclosed is a resin-sealed semiconductor device which has an insulation substrate 1 having a chip-mounting portion is, leads which are radially disposed around the chip-mounting portion, an IC chip mounted on the chip-mounting portion and connected electrically with inner portions of the leads, a resin which seals over an area which includes the IC chip and the inner leads and does not include a peripheral portion of the insulation substrate and the outer leads, and outer portion of terminals which are electrically connected with the outer leads which are left out of the resin. |
