| 摘要 |
A resin-sealed semiconductor device according to the present invention, a heat radiation plate is formed around a bed on which a semiconductor chip is mounted. The bed and heat radiation plate are partially connected to each other by connecting pins. The connecting pins are inclined by depression to locate the heat radiation plate higher than the bed. A lead frame is fixed onto the undersurface of the heat radiation plate by an insulation tape made of a thermoplastic tape. Inner leads of lead terminals of the lead frame and electrode pads on the semiconductor chip are then bonded by Au wires, respectively. After that, the semiconductor chip is sealed with resin and outer leads of the lead terminals are formed to have a predetermined shape. Since the lead frame is fixed onto the undersurface of the heat radiation plate, the insulation tape is not required immediately under the bonding points on the inner leads. Thus, heat generated from a heat source can be transmitted to the inner leads with high efficiency, and stable bonding can be performed without being influenced by the insulation tape. |
