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经营范围
发明名称
SEMICONDUCTOR CHIP PACKAGE FOR REDUCED NOISE
摘要
申请公布号
KR0176112(B1)
申请公布日期
1999.03.20
申请号
KR19950020796
申请日期
1995.07.14
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
LEE, SANG-HYUK;SHIM, SUNG-MIN
分类号
H01L23/28;(IPC1-7):H01L23/28
主分类号
H01L23/28
代理机构
代理人
主权项
地址
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