LEAD-EXPOSURED SEMICONDUCTOR PACKAGE

摘要

An improved package is thinner with increased memory capacity and improved heat emission effect. The package includes a plurality of leads, where each lead comprises a first connection lead and a second connection lead with upper and lower surfaces. An integrated chip, such as a semiconductor chip, is attached to a portion of the upper surface of the first connection lead. The chip and leads are molded such that the lower surface of the first connection leads and upper surface of the second connection leads are exposed.