THREE-DIMENSIONAL STACKED PACKAGE

摘要

A three dimensional stack package device that can realize vertical electrical interconnection of the stacked individual package devices without a cost increase or additional complicated processing steps. The three dimensional package device includes a plurality of individual semiconductor devices, each individual semiconductor device including (1) a semiconductor chip, (2) a protective body for encapsulating the semiconductor chip, (3) a lead frame comprising inner lead portions electrically interconnected to the semiconductor chip and included within the protective body, outer lead portions formed as a single body with the inner lead portions, and coupling lead portions located between the inner and outer lead portions and having a top surface exposed upward from the protective body, and (4) a plurality of vertical interconnection elements attached to a back surface of the coupling lead portions and exposed from the protective body in a direction opposing the exposed top surface of the coupling lead portions, whereby, an electrical interconnection of the plurality of individual semiconductor devices is accomplished by the coupling lead portions and the vertical interconnection elements, and electrical interconnection of the three dimensional stack package device to an external circuit device is accomplished by the outer lead portions of a lowermost semiconductor device.