METHOD FOR METALLIZATION OF A SUBSTRATE CONTAINING ELECTRIC NON-CONDUCTIVE SURFACE AREAS

摘要

During the metallization of bore hole walls in circuit boards with copper inner layers, it is difficult to obtain a sure contacting of the deposited metal layers on the frontal faces of the inner layers. In order to solve this problem, a method for metallization of a substrate containing electric non-conductive surface areas is carried out in the following steps: a) treatment of the substrate with a solution containing one precious metal colloid; b) treatment with an etching solution containing hydrogen ions with a maximum concentration of 0.5 Mol/kg solution and hydrogen peroxide; c) creating a first metal layer on the non-conducting surface by means of non-conducting metallic coating; d) creating a second metal layer on the first metal layer by means of electrolytic metallic coating.