| 摘要 |
A mounting for a flip chip integrated circuit device having a light sensitive cell is disclosed. The mounting includes an insulating substrate having an aperture between its first and second surfaces. A flip chip integrated circuit device is placed on the first surface of the substrate. A light sensitive cell of the integrated circuit device faces the aperture. Solder bumps on the integrated circuit are electrically connected to corresponding conductive metallizations on the first surface of the substrate. A transparent aperture cover is affixed to the second surface of the substrate with an adhesive bead. The aperture cover extends over the aperture, allowing light to be transmitted through the aperture cover to the light sensitive cell. The side surfaces of the aperture cover include features for locking the adhesive bead to the aperture cover. The numerous locking features disclosed include protrusions and indentations that engage the adhesive bead and thereby enhance the connection of the aperture cover to the substrate. |
