发明名称 Verfahren zur Herstellung eines elektronischen Bauelementes
摘要 An electronic component comprises an inductive element (48) which includes a pair of zigzag parts (30a,30b), a pair of first terminals (29a,29b) connected to one side of the zigzag parts, a connection part (31) connected to the other side of the zigzag parts, an electrode (32) disposed in the middle of the connection part, a second terminal (33) provided on the extensional position of the electrode, and an exterior mold (34) having a gap (35) in the middle in order to expose the fronts of electrode and second terminal. <IMAGE>
申请公布号 DE69323383(D1) 申请公布日期 1999.03.18
申请号 DE1993623383 申请日期 1993.10.12
申请人 MATSUSHITA ELECTRONICS CORP., KADOMA, OSAKA, JP 发明人 KUMEJI, YASUSHI, KADOMA-SHI, OSAKA, JP;NISHIMURA, SEIICHI, HIRAKATA-SHI, OSAKA, JP;NAKAJIMA, YOSHINOBU, KATANO-SHI, OSAKA, JP;ITOU, MAKOTO, HYOGO 668, JP
分类号 H03H3/00;H03H7/01;(IPC1-7):H03H7/01 主分类号 H03H3/00
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