发明名称 |
Improvements in or relating to leadframes |
摘要 |
The invention relates to a single piece leadframe that can be used in current semiconductor device production. The leadframe has a plurality of segments in a horizontal plane, a chip mount pad in a different horizontal plane, and another plurality of segments connecting said chip mount pad with said leadframe. The latter plurality of segments has a geometry designed so as to tolerate bending and stretching beyond the limit of simple elongation based upon the inherent material characteristics. The chip mount pad of said leadframe provides direct thermal contact to an external heat conductor or heat sink by being designed so as to extend through the encapsulating package. The exposed chip pad can also be used electrically as a ground connection. <IMAGE> <IMAGE> |
申请公布号 |
EP0902473(A2) |
申请公布日期 |
1999.03.17 |
申请号 |
EP19980307065 |
申请日期 |
1998.09.02 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
CARTER, BUFORD H., JR.;CLARK, JESSE E.;KEE, DAVID R. |
分类号 |
H01L23/50;H01L23/495 |
主分类号 |
H01L23/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|