Object wet cleaning method for e.g. semiconductor wafer

摘要

The method involves immersing an object into cleaning solution and the quantity of the chemical is changed according to the solution temperature. The injection of the chemical is carried out in stages for controlling the chemical concentration, which also depends on the clean water volume. The cleaning solution can be an ammoniac solution (NH4OH), or hydrofluoric acid (HF), or a rinsing solution, such as clean water. An independent claim is included for a cleaning apparatus.