| 摘要 |
<p>PURPOSE:To decrease the mandays of machining, and to obtain a semiconductor device at low cost by exposing the Cu surface of a lead frame blank as it is to the surface of an external leading-out lead. CONSTITUTION:A semiconductor element 4 is mounted and fixed onto a lead frame 1 composed of Cu or a Cu alloy, and the electrode of the semiconductor element 4 and an inner lead are connected through wire bonding, and resin- molded 6. An oxide on the surface of the lead frame 1 in a section not resin- molded is removed, and the surface of the lead frame 1 is washed and dried. The unnecessary section of the lead frame 1 is cut lastly, and an external leading-out lead 1a is molded in a specified necessary shape, thus completing a semiconductor device. Accordingly, the film of solder plating, etc., is not formed to the external leading-out lead, and the complicating of an assembling process and the increase of cost can be avoided as Cu or a Cu alloy as the blank of the lead frame is left as it is.</p> |
