| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to deal with a multi-pin structure by narrowing a lead pitch in a lead frame of QFP type. SOLUTION: Since a die pad 20 has a support 30, its end is connected to an insulating substance 31 to be held, a suspension lead can be excluded. Since no suspension lead is provided and an inner lead region has an allowance, the lead-in (arrangement) of inner lead groups 21, 22, 23, 24 is not restricted. Further, the specific part of the groups 21, 22, 23, 24 can be branched and arranged on the adjacent inner lead group region in accordance with the number of the bonding pads of the element to be mounted. Thus, the spread of metal fine wires across the suspension lead of prior art can be eliminated to prevent the decrease in the reliability of a resin-sealed semiconductor device. |
