发明名称 |
Use of an insulating adhesive tape, lead frame and semiconductor device employing the tape |
摘要 |
An insulating adhesive tape comprises a base supporting film and an adhesive layer formed on at least one surface thereof, said adhesive layer being formed of a thermoplastic polymer comprising a thermoplastic polyimide. The thermoplastic polymer has a glass transition temperature ranging from 180 DEG C to 280 DEG C and an elastic modulus ranging from 10<1><0> dyne/cm<2> to 10<1><1> dyne/cm<2> at 25 DEG C, said modulus including a value ranging from 10<2> dyne/cm<2> to 10<9> dyne/cm<2> at a temperature between 250 DEG C and 300 DEG C. |
申请公布号 |
EP0605112(B1) |
申请公布日期 |
1999.03.17 |
申请号 |
EP19930309704 |
申请日期 |
1993.12.03 |
申请人 |
MITSUI CHEMICALS, INC. |
发明人 |
MORITA, MORITSUGU;TAGAWA, KIMITERU;ABE, KENJI;MINETA, NAOSHI;KUBO, TAKAYUKI;KIBA, SHIGEO;OHKAWADO, ETSUO;TANABE, KENJI |
分类号 |
C08G73/10;C09J179/08;H01B3/30 |
主分类号 |
C08G73/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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