| 摘要 |
The semiconductor device has a plurality of bonding pads arranged along opposing longitudinal sides of a semiconductor integrated circuit, and the bonding pads are connected to a power supply interconnection layer and a ground interconnection layer which are provided on the main surface of the semiconductor integrated circuit with a film coat interposed. By this structure, it becomes possible to shorten the extension of power supply lines by wirings, and hence power source can be reinforced.
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