| 摘要 |
<p>PROBLEM TO BE SOLVED: To make feasible gaining the strength against mechanical impulse or package crack enhancing the packaging efficiency while maintaining the LCR characteristics of SHP, by tilting the semiconductor device with the outer lead part turning underside. SOLUTION: As for the first demiconductor device, after arranging to tilt a package 21 on a packaging substrate 30 using a tilting strut 17, an outer lead 16b is fixed to a wiring pattern on the packaging substrate 30 using a solder 31. Next, as for the second semiconductor device, a flattening struct 18 of the second semiconductor device is arranged to be positioned above a terminal of the outer lead 16b led out of the first package 21. Next, as for after the third, respective semiconductor devices are similarly packaged with the substrate 30. Through these procedures, the semiconductor devices can maintain the satisfactory strength against the mechanical impact or package cracks while avoiding the deterioration in characteristics.</p> |
