| 发明名称 |
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| 摘要 |
An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed. <IMAGE> |
| 申请公布号 |
JP2871591(B2) |
申请公布日期 |
1999.03.17 |
| 申请号 |
JP19960118831 |
申请日期 |
1996.05.14 |
| 申请人 |
NIPPON DENKI KK |
发明人 |
ICHIKAWA SEIJI;HIROKAWA TOMOAKI;KIMURA TOMOAKI;SATO TAKU;TANAKA JUNICHI;UCHIDA KENJI;OBARA MASATOSHI;OGIWARA MASAO;MURATA TOMOJI;KUBOTA SUSUMU |
| 分类号 |
H01L21/56;H01L23/29;H01L23/31 |
主分类号 |
H01L21/56 |
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