| 摘要 |
PROBLEM TO BE SOLVED: To prevent thermal oxidation and improve reliability in joining between a lead and an element, by providing a heater plate below an island wherein thermal conductivity of a heating region of the island is different from that of a heating region of an internal lead between a single heat source connected to a temperature control unit and a semiconductor element. SOLUTION: An internal lead 4 fixed by a clamp 12 and a bonding pad 2 on a semiconductor element 1 mounted on an island 3 are bonded with each other by a thin metal wire (wire) 5 having a bonding ball 6 on a side. At this time, a single heater 10 connected to a temperature control unit 11 is placed below the island 3. A heater plate 9 with thermal conductivity for an island heating region 7 different from that for an internal lead heating region 8 is placed between the heater 10 and the semiconductor element 1, and wire-bonding is performed while surface temperature distributions of the semiconductor element 1 and the internal lead 4 differ from each other. |
