| 摘要 |
PROBLEM TO BE SOLVED: To prevent reduction of the manufacturing yield and reliability of a solid image pickup device which are caused by the generations of voids and air paths in its bonding portion. SOLUTION: Forming wiring patterns 5 on the surface of an insulating substrate 1, a solid image pickup element 2 connected electrically with the wiring patterns 5 is mounted on the insulating substrate 1 to fill a tramisssive resin into the cavity formed by bonding a cap 7 to the insulating substrate 1. Also, through holes 13 provided in the vertical direction of the insulating substrate 1 and for connecting electrically the wiring patterns 5 and (11) with each other which are provided respectively on the front and rear surfaces of the insulating substrate 1 are provided in the portions inner than the bonding portion of the cap 7 to the insulating substrate 1.
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