发明名称 Method for making devices having thin load structures
摘要 A resistive load structure and method for making a resistive load structure for an integrated circuit includes the use of an amorphous silicon "antifuse" material. The resistive load structure can be used in an SRAM cell to provide a load to counteract charge leakage at the drains of two pull-down transistors and two pass transistors of the SRAM cell. The resistive load structure is advantageously formed by depositing an amorphous silicon pad over a conductive via, and the resistance of the resistive load structure is controlled by adjusting the thickness of the amorphous silicon pad and varying the diameter of the underlying conductive via.
申请公布号 US5882997(A) 申请公布日期 1999.03.16
申请号 US19970955030 申请日期 1997.10.21
申请人 VLSI TECHNOLOGY, INC. 发明人 SUR, JR., HARLAN LEE;BOTHRA, SUBHAS
分类号 G11C11/412;H01L21/02;H01L27/11;(IPC1-7):H01L21/44 主分类号 G11C11/412
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