Method for adhering a metallization to a substrate

摘要

There is disclosed herein a method for adhering metallizations to a substrate, comprising the steps of: (1) providing a substrate having a first surface; (2) applying a coating atop the first surface, such that the coating has a second surface bonded to the first surface, and a third surface generally conforming with the second surface; (3) etching away material from the third surface, so as to roughen and form pits in the third surface; and (4) attaching a metallization to the pits in the third surface by plating, sputtering, or similar means.