Electrical connection substrate having a through hole for connecting a chip to an opposite surface of the substrate

摘要

An electrical connection structure for electrically connecting a chip on a mounting surface of a printed circuit board to a back surface of the printed circuit board includes a printed circuit board having a mounting surface and a back surface, the mounting and back surfaces being opposite surfaces of the printed circuit board, a through hole through the printed circuit board and extending from the mounting to the back surface, an electrical conductive layer between the mounting and back surfaces and a layer that permits wiring over the through hole that is electrically isolated from the electrical conductive layer.