| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a memory module which can perform the noise countermeasure of each memory chip on a module substrate, and can achieve simplification of the mounting process including noise countermeasure parts when module substrates are mounted on various kinds of substrates. SOLUTION: On a module substrate 2, bare chips 1 for memory which are cut out from a semiconductor wafer, a dumping resistor 6 for noise countermeasure and a bypass capacitor 7 are mounted. The dumping resistor 6 is inserted into a signal line which connects chip pad 3 on the bare chip 1 for the memory and an external connection terminal 8 of the module substrate 2. Furthermore, the bypass capacitor 7 connects the signal line which connects the pad 3 for the chip in correspondence with a terminal imparting a power supply voltage and the external connecting terminal 8 in correspondence with a terminal imparting this power supply voltage, and the signal line which connects the pad 3 for the chip in correspondence with a terminal imparting a ground level and the external connecting terminal 8 in correspondence with a terminal imparting this ground level.</p> |
