| 摘要 |
PROBLEM TO BE SOLVED: To form patterns in such a manner that the flanks of the patterns are made perpendicular to a ground surface by using a mask formed by a metal compd. contg. Ni or Co metal as a parent material and contg. at least group 3B elements and/or group 5B elements. SOLUTION: A resist frame 14 opened in the parts corresponding to the mask 15 to be formed is formed on an upper magnetic pole layer 13 in a stage for forming the patterns of the writing magnetic pole layers of a compound thin-film magnetic head. The mask 15 is then formed by electrolytic plating. The formed mask 15 is the metal compd. contg. the Ni or Co metal as the parent material and contg. at least the group 3B elements and/or group 5B elements. The film thickness is 1.0 to 3.0μm. Then, an etching rate is extremely lower than the etching rate of the object layer to be etched and, therefore, the constitution is made possible at the extremely small thickness. The mask having high anisotropy (perpendicularity of 90 deg.±2 deg. to the ground surface) is obtd.
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