| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which an inexpensive printed wiring board which can be used for a variety of electronic equipment can be formed easily in various thicknesses and on which parts can be mounted at a high packing density. SOLUTION: A double-sided printed wiring board 9 is formed in such a way that a through hole 4 is formed through a substrate 1 carrying copper foil 2 on both surfaces after a mold-releasable film 3 is stuck to at least one surface of the substrate 1 and the hole 4 is filled up with conductive paste 5. Then, after the film 3 is removed and heat-resistant films 6 placed on both surfaces of the substrate 1 are heated and pressurized, a prescribed wiring pattern 7 is formed of the copper foil 2 by etching, etc. Therefore, the thickness of the wiring board 9 can be set with a high degree of freedom. |
