| 摘要 |
PROBLEM TO BE SOLVED: To provide a COB(chip-on-board package).IC, which cannot be seen through even if the IC card is thin. SOLUTION: A COB.IC 10 as this device is constituted by providing an insulating sheet 15 wherein 9 outer leads 16 are fixed to the first main surface, a semiconductor chip 21 which is arranged on the second main surface of a sheet 5 and electrically connected to each outer lead 16, and a resin sealing body 28 by which the semiconductor chip 21 is sealed with the resin. In this case, the resin sealing body 28 is formed in white color or whitish color. In the IC card wherein this COB.IC 10 is contained in the containing concave part, the resin sealing body 28 becomes white or whitish even when, e.g. the thickness of the bottom of the containing concave part is formed thin. Therefore, see-through of the resin sealing body 28 can be prevented. Since the see-through of the resin sealing body can be prevented in this way, and the reduction of the fine appearance of the IC card and the like can be prevented. |
