发明名称 |
Polyamide hotmelt adhesive |
摘要 |
A composition of matter useful as a hotmelt adhesive is provided. The composition is comprised of a polyamide based on dimerized fatty acid and having an amine value higher by at least two units than the acid value of said polyamide and a filler comprised of a carbonate. The filler is preferably comprised of fine particles of calcium carbonate. The adhesive is particularly useful for bonding metals, e.g. to plastics and the bonding of cables with multilayer sheaths, e.g. in optical cables and power cables.
|
申请公布号 |
US5883172(A) |
申请公布日期 |
1999.03.16 |
申请号 |
US19970939425 |
申请日期 |
1997.09.29 |
申请人 |
HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN |
发明人 |
HEUCHER, REIMAR;KOPANNIA, SIEGFRIED;MAASSEN, ULRIKE |
分类号 |
C08G69/34;C09J177/08;(IPC1-7):C08K3/26;C08L77/08 |
主分类号 |
C08G69/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|