Method for soldering

摘要

A method for soldering components to opposite sides of a receptive element includes the steps of applying a solder formulation to both sides of the receptive element (201) and placing components on a first side of the receptive element (204). The solder formulation is hardened on the first side of the receptive element (205). Components are placed on a second side of the receptive element and the solder formulation on the second side of the receptive element is hardened. The components are fixed to the receptive element by performing a single reflow operation (208).