发明名称 |
Stack module |
摘要 |
A stack module is provided which relieves thermal stress generated in a heat-radiating element and provides improved cooling efficiency. Connection bumps of a plurality of mounting substrates, onto which are mounted semiconductor chips are used to stack the substrates to four levels, three wave-shaped heat-radiating elements, made of copper, being in thermal contact between the semiconductor chips of three of the mounting substrates and the rear surfaces of three of the mounting substrates, making use of the spring elasticity of the heat-radiating elements to establish this thermal contact.
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申请公布号 |
US5883426(A) |
申请公布日期 |
1999.03.16 |
申请号 |
US19970844320 |
申请日期 |
1997.04.18 |
申请人 |
NEC CORPORATION |
发明人 |
TOKUNO, KENICHI;MORISAKI, IKUSHI;DOYA, AKIHIRO;BONKOHARA, MANABU;SENBA, NAOJI;SHIMADA, YUUZOU;UTUMI, KAZUAKI |
分类号 |
H01L23/427;H01L23/31;H01L23/367;H01L25/065;H01L25/07;H01L25/10;H01L25/11;H01L25/18;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/427 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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