| 摘要 |
PROBLEM TO BE SOLVED: To enable connection at a low temperature and reduce thermal influence to a circuit member, by interposing a film-like circuit connection material containing photo-setting components and conductive particles between opposite first and the second connection terminals, and by electrically connecting the first and second connection terminals with each other by application of heat and pressure and light irradiation. SOLUTION: First and second connection terminals are oppositely placed, and a film-like circuit connection material containing photo-setting components and conductive particles is interposed between them. Then, the first and the second connection terminals are electrically connected with each other by application of heat and pressure and light irradiation. The film-like circuit connection material is mainly photo-cured, adhesive is melted and made to flow by the application of heat and pressure, and resin components in the vicinity of a part where the connection terminals and the conductive particles are in contact are sufficiently eliminated so that the conductive particles are sufficiently pressure-bonded between the connection terminals. Thus, heating may be performed to a temperature where the adhesive can flow, and a connection temperature of a circuit member can be lowered. |
