发明名称 palladium layers deposition process
摘要 A formaldehyde-free chemical bath containing a palladium salt, a nitrogenated completing agent, and formic acid or formic acid derivatives, at a pH of greater than 4 and a process of using the chemical bath for depositing on a metal surface an adhesive, permanently glossy, bright palladium layer with few pores. The metal surface may be pretreated in a cementation palladium bath. The metal surface contains at least one of copper, nickel, and cobalt, as well as their alloys with one another and/or with phosphorus or boron.
申请公布号 US5882736(A) 申请公布日期 1999.03.16
申请号 US19970914956 申请日期 1997.08.20
申请人 ATOTECH DEUTSCHLAND GMBH 发明人 STEIN, LUDWIG;MAHLKOW, HARTMUT;STRACHE, WALTRAUD
分类号 C23C18/42;C23C18/44;(IPC1-7):B05D1/18;B05D3/10;B05D5/12 主分类号 C23C18/42
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