发明名称 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FORMATION OF PATTERN BY USING THE SAME AND ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide a negative photosensitive resin compsn. with which a fine polymer film pattern having excellent adhesion property with a substrate or the like can be produced in safe and easy processes. SOLUTION: This resin compsn. contains a thermosetting polymer precursor which is dehydrated, cyclized and hardened by heating, and a photosensitive thermosetting accelerator. The photosensitive thermosetting accelerator consists of a compd. with substitution of protective substituents which leave by irradiation of light, or a N-oxide compd. in which oxide groups are transferred by irradiation of light to generate the thermosetting acceleration performance. Or, the photosensitive thermosetting accelerator consists of a compd. which produces an acid by irradiation of light to generate the thermosetting acceleration performance. Moreover, the photosensitive thermosetting accelerator may consist of a latent thermosetting accelerator which can be changed into a compd. showing the thermosetting acceleration performance by the reaction with an acid and of a photoacid producing agent which produces an acid by irradiation of light.
申请公布号 JPH1172918(A) 申请公布日期 1999.03.16
申请号 JP19980182961 申请日期 1998.06.29
申请人 TOSHIBA CORP 发明人 KAWAMONZEN YOSHIHIRO
分类号 C08G73/10;C08L79/08;G03F7/004;G03F7/038;H05K3/28;H05K3/46 主分类号 C08G73/10
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