| 摘要 |
PROBLEM TO BE SOLVED: To increase the occupying rate of a chip in the package size of a semiconductor substrate and to cope with the miniaturization of the substrate. SOLUTION: In a circuit 130A of a device 100, an inner terminal 131 and an outer terminal 132 of a semiconductor element 110 and a lead 133, which links the inner terminal 131 and the outer terminal 132 as a unitary body, are arranged independently to each other by a plurality of numbers in the approximately flat plane, and terminal surfaces of 131S for respective connection are arranged on both sides, which are different from each other. Furthermore, the inner terminal part 131 and the lead part 133 are formed thinner than the outer terminal 132. A terminal surface 132S of the outer terminal part 132 is made to protrude from the surface of the lead part 133. In the semiconductor element 110, the surface of the semiconductor element 110 that is opposite from the terminal parts 131 and 132 is bonded and fixed to a circuit 130A through an insulating layer 120 at the surface of the side of the terminal surface 131S of the inner terminal 131 inner than the inner terminal part 131 of a circuit part 130A and mounted on the circuit part 130A. A terminal (pad) 111 of the semiconductor element 110 and the terminal surface 131S of the inner terminal part 131 are electrically connected with a wire 140. Furthermore, a path of the outer terminal part 132 of the circuit part 130A is exposed to the outside and sealed with resin.
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