发明名称 |
Polishing apparatus |
摘要 |
A polishing apparatus makes it possible to accurately detect the temperature of a workpiece during polishing and to perform polishing end point determination on the basis of this detected temperature. The polishing apparatus polishes irregularities in a surface of a workpiece such as for example a semiconductor wafer to a flat and mirror-like finish. A top ring holding a semiconductor wafer is provided with a temperature sensor. Frictional heat generated in the semiconductor wafer by polishing is detected by the temperature sensor, and a polishing end point is determined on the basis of the detected temperature.
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申请公布号 |
US5882244(A) |
申请公布日期 |
1999.03.16 |
申请号 |
US19970967767 |
申请日期 |
1997.11.10 |
申请人 |
EBARA CORPORATION |
发明人 |
HIYAMA, HIROKUNI;WADA, YUTAKA;TAKAHASHI, TAMAMI |
分类号 |
B24B37/00;B24B37/04;B24B49/14;(IPC1-7):B24B49/00 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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