| 摘要 |
PROBLEM TO BE SOLVED: To minimize alignment shifts during transfer of photo mask pattern, when the surface of a semiconductor wafer is chemically and mechanically polished by equalizing the rotational speed of a polishing table with the rotational speed of a wafer carrier. SOLUTION: A wafer carrier presses a fixed wafer using a vacuum chuck or the like against a polishing table with a polishing pad placed on its surface, and holds the wafer there. The polishing table and the wafer carrier are turned together during polishing. Polishing agent (slurry) having specified chemical properties is applied to the contact plane between the wafer and the polishing pad. Further, an ammeter is placed between a motor for turning the wafer carrier and a power supply. At this time, the rotational speed of the polishing table is equalized with the rotational speed of the wafer carrier. As a result, a point on the wafer is polished regardless of its position on the wafer, while homogeneity and uniformity are maintained. |
