| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin compsn. which has stable physical properties and is suitable for insulating electrical and electronic parts by defoaming a mixture of an epoxy resin and a filler by stirring it under a reduced pressure so that air bubbles are removed in the shortest necessary time while keeping the viscosity increase ratio of the mixture in a specified range. SOLUTION: An epoxy resin and a filler pref. having an average particle size of 6-10μm are mixed and then defoamed under stirring under a reduced pressure, pref. at a temperature of 40-120 deg.C, under a reduced pressure of 0.4-5 Torr, under such a strength of stirring that air bubbles are generated after mixing and are allowed to escape, while the viscosity is being measured on-line e.g. with a capilary viscometer so that the viscosity increase ratio of the mixture is kept at 20% or lower. The amt. of the filler compounded is pref. 50-600 wt.% of the epoxy resin. Thus is obtd. an insulating resin compsn. excellent in workability (flowability, nonfoamability) in pouring into electric and electronic parts.
|
