Mini-module with upwardly directed leads

摘要

A power module (10) with leads (16) extending upwardly. The circuit components (C) and connections (L) of the power module are arranged upon a substrate having interface leads (16) attached thereto extending away from the undersurface of the substrate (12). The interface leads extend through openings (14g) in a form-fitting molded case (14). The case has an open center region (14i) to facilitate performance of final assembly steps upon the module and is subsequently covered with a rugged lid (17) and is encapsulated with a suitable potting material (18). The interior of the module is filled with a gel to provide moisture-proof protection.