Packaged semiconductor device has a ball grid array substrate

摘要

In a semiconductor device which has a ball grid array (BGA) substrate consisting of an intermediate insulating layer sandwiched between upper and lower multilayer insulating layers, the insulating layers consist of an organic material with a thermal expansion coefficient matching that of a circuit board on which the device is mounted. A semiconductor device has (a) a BGA substrate as described above; (b) conductors on the top surface of each insulating layer and within the substrate; (c) solder balls on the outer surface of the lower insulating layer; and (d) a semiconductor chip which has electrodes for connection to the conductors and which is electrically connected to the solder balls by vias provided in each insulating layer. Independent claims are also included for similar semiconductor devices, in which (i) the electrodes are arranged in an annular region on the chip and the voltage supply and the earth are connected respectively to electrodes at the outermost and innermost peripheral rows; or (ii) the device has a resin sealant for intimately contacting the chip with the BGA substrate, an external heat sink for dissipating heat produced in the chip and a ring which both spaces and connects the BGA substrate and the heat sink. Preferred Feature: The linear thermal expansion coefficient of the insulating layer material is 1/*10<-5>-6/*10<-5>/ deg C when that of the circuit board is 1/*10<-5>-2/*10<-5>/ deg C.