Verfahren zum Herstellen eines Halbleiterwafers und Anlage hierfür

摘要

An ingot is conveyed to a slicing machine by an ingot loader. Then, the ingot is cut into a wafer by the slicing machine. And, the cut wafer is conveyed to a peel-off portion and soaked in a warm water tank for a predetermined time so that the adhesive of the slice base can be heat softened, and then the slice base is hammered by a hammer rod so as to be peeled off from the wafer. Further, the wafer, from which the slice base has been peeled off, is conveyed to a wash-dry device, and washed and dried. The washed and dried wafer is conveyed to a surface inspecting device by a conveying device and judged a pass or fail to the wafer standard in the surface inspecting device. And, the passed wafer is conveyed to a chamfering device and the edge of the wafer is chamfered by the chamfering device. Then, the chamfered wafer is washed and dried by a wash-dry device, thereafter, conveyed to the storing part by the conveying device and stored.